Fortiming RoHS (Pb-Free) Compliance Roadmap

RoHS (Pb-Free) Overview

In December 2002, the European Union Parliament approved the content of two directives to better control the management of waste electronic equipment.  The two directives are the Waste from Electrical and Electronic Equipment (WEEE) and the Restriction of Hazardous substances (RoHS).  The WEEE addresses the collection and treatment requirements of waste electronic equipment for the member countries.  The RoHS sets phase-out dates for the use of lead (Pb) and several other materials (Cd, Hg, Cr VI, etc) contained in electronic products.  The RoHS states that the following six (6) hazardous substances are restricted for use in electrical and electronic equipment unless there is an exemption provided in the rule: Mercury (Hg), Lead (Pb), Hexavalant Chrome (CrVI), Cadmium (Ca), Poly-brominated bi-Phenol (PBB), and Poly-brominated di-Phenol Ether (PBDE).

Fortiming RoHS (Pb-free) Program

The Fortiming Pb-free program is implemented in accordance with European Union (EU) Legislation titled "Restriction of the use of certain Hazardous Substances (RoHS)" including banning the use of Pb and other five hazardous substances in electronic assemblies after July 1, 2006.  It can also be classified as RoHS 6/6 Compliance.

Definitions

RoHS Compliance Classification: Component and Assembly shall be compliant to Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment.

Pb-Free Classification: Component and Assembly Pb content shall be less than 0.1% by weight of the device (in accordance to IPC/EIA J-STD-006) and shall not be intentionally introduced.

Components: Fortiming's definition of components apply to quartz crystal devices.

Assemblies: Fortiming's definition of assemblies apply to oscillator devices and modules (XO, TCXO, OCXO. VCXO and multi-pole MCF's)

Recommended Solder Composition

Fortiming has qualified the following Pb-free solder composition recommended by the North American Electronics Manufacturing Initiative: Sn95.5Ag3.9Cu0.6

RoHS Compliant Part Number Identification:

When applicable, the Fortiming specification sheet shall indicate if the device is classified as RoHS compliant (Pb-free).

RoHS 5/6 Compliance  RoHS56.jpg

RoHS 5/6 compliance indicates that 5 out of the 6 hazardous substances are not present in the device.  However, these devices do contain Lead Pb, as permitted by the following exemptions specified in the Annex of the RoHS directive.

1. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
2. Lead in solders for servers, storage and storage array systems.
3. Lead in solders for network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunication.

These parts can be identified by the blue RoHS 5/6 diamond above.

Process Compatibility

All Fortiming RoHS compliant products are backwards compatible to earlier lower temperature solder reflow profiles.

Marking and Labeling

Fortiming has a Pb-free labeling method for the packaging of all Pb-free products.  The lowest level shipping container will identify the products as Pb-free, if the customers desire.

Fortiming's Two Phase Implementation Plan

Fortiming is implementing their RoHS (Pb-free) Program in two phases. The details of the two phases are listed below.

  • Phase 1:
    SMD and Through-hole Components and Assemblies: Able to withstand the Pb-free 260C solder reflow profiles shown below.  Internal PCB, components, solders, and terminations may contain Pb.  External packaging and terminations may contain Pb
    • SMD Components and Assemblies Reflow Methods
      • Infrared/Convection Reflow (per IPC/JEDEC J-STD-020):
        • Average ramp-up rate of 3C/second maximum
        • Pre-heat from 150C to 200C, 60 to 180 seconds
        • Time maintained above a reflow temperature of 217C, 60 to 150 seconds
        • Target Peak Temperature of 250C +0/-5C, 20 to 40 seconds
        • Peak Temperature of 260C maximum for 10 seconds maximum
        • Average ramp-down rate of 6C/second maximum
        • Time from 25C to Peak Temperature, 8 minutes maximum (one time)
      • Manual Solder Reflow
        • Target Peak Temperature of 250C +0/-5C, 5 to 10 seconds
        • Peak Temperature of 260C maximum for 10 seconds maximum
    • Through-hole Components and Assemblies Reflow Methods
      • Wave Solder (Back of board Solder Bath Reflow)
        • Pre-heat from 150C to 200C, 60 to 180 seconds
        • Peak Temperature of 260C maximum for 10 seconds maximum (one time)
      • Manual Solder Reflow
        • Target Peak Temperature of 250C +0/-5C, 5 to 10 seconds
        • Peak Temperature of 260C maximum for 10 seconds maximum
  • Phase 2:
    SMD and Through-hole Components and Assemblies: Able to withstand Pb-free 260C solder reflow profile below.  Internal PCB, components, solders, and terminations are Pb-free.  External packaging and terminations are Pb-free.  The device is RoHS compliant.
    • SMD Components and Assemblies Reflow Methods
      • Infrared/Convection Reflow (per IPC/JEDEC J-STD-020):
        • Average ramp-up rate of 3C/second maximum
        • Pre-heat from 150C to 200C, 60 to 180 seconds
        • Time maintained above a reflow temperature of 217C, 60 to 150 seconds
        • Target Peak Temperature of 250C +0/-5C, 20 to 40 seconds
        • Peak Temperature of 260C maximum for 10 seconds maximum
        • Average ramp-down rate of 6C/second maximum
        • Time from 25C to Peak Temperature, 8 minutes maximum (one time)
      • Manual Solder Reflow
        • Target Peak Temperature of 250C +0/-5C, 5 to 10 seconds
        • Peak Temperature of 260C maximum for 10 seconds maximum
    • Through-hole Components and Assemblies Reflow Methods
      • Wave Solder (Back of board Solder Bath Reflow)
        • Pre-heat from 150C to 200C, 60 to 180 seconds
        • Peak Temperature of 260C maximum for 10 seconds maximum (one time)
      • Manual Solder Reflow
        • Target Peak Temperature of 250C +0/-5C, 5 to 10 seconds
        • Peak Temperature of 260C maximum for 10 seconds maximum

Product Phase Matrix

TH = Through-hole devices; SMD = Surface mount devices

Y = Available now; TBD = To Be Determined, Contact factory for future availability

Lead-Free = RoHS Compliant. Complies with both Phase 1 and 2.

Quartz Crystal Devices

Product Series Package Phase 1 Phase 2 Internal Pb % External Pb % Lead Category
XKC26 TH Y Y 0% Pb 0% Pb Lead-Free, Date Code "Feb 2006" & later
HC51U TH Y TBD 0% Pb <0.1% Pb
HC49U, 2.4576MHz and lower TH Y TBD <0.1% Pb 0% Pb
HC49U >2.4576MHz TH Y Y 0% Pb 0% Pb Lead-Free
HC49S/HC49SS TH Y Y 0% Pb 0% Pb Lead-Free
UM1 TH Y Y 0% Pb 0% Pb Lead-Free
UM5 TH Y Y 0% Pb 0% Pb Lead-Free
CY309/CY310 TH Y Y 0% Pb 0% Pb Lead-Free, Date Code "Feb 2006" & later
WXC26 TH Y Y 0% Pb 0% Pb Lead-Free
XCS75 SMD Y Y 0% Pb 0% Pb Lead-Free
XCS64 SMD Y Y 0% Pb 0% Pb Lead-Free
XCS53 SMD Y Y 0% Pb 0% Pb Lead-Free
XCS42 SMD Y Y 0% Pb 0% Pb Lead-Free
XCS32 SMD Y Y 0% Pb 0% Pb Lead-Free
HC49SM/HC49SSM SMD Y Y 0% Pb 0% Pb Lead-Free
HC494PD SMD Y Y 0% Pb 0% Pb Lead-Free
XPS SMD Y TBD 0% Pb <0.1% Pb
HC49USMD >2.4576MHz SMD Y Y 0% Pb 0% Pb Lead-Free
UM1SMD SMD Y Y 0% Pb 0% Pb Lead-Free
UM5SMD SMD Y Y 0% Pb 0% Pb Lead-Free
WXP2A SMD Y Y <0.1% Pb 0% Pb RoHS

Clock Oscillators (XO)

Product Series Package Phase 1 Phase 2 Internal Pb % External Pb % Lead Category
XO53 SMD Y Y 0% Pb 0% Pb Lead-Free
XO75 SMD Y Y 0% Pb 0% Pb Lead-Free
XO75PE SMD Y Y 0% Pb 0% Pb Lead-Free
XO75LVDS SMD Y Y 0% Pb 0% Pb Lead-Free
XOPJ SMD Y Y <0.1% Pb 0% Pb Lead-Free, Date Code "Feb 2006" & later
SXO53 SMD Y Y 0% Pb 0% Pb Lead-Free
XO14E TH Y Y 0% Pb 0% Pb Lead-Free, Date Code "Feb 2006" & later
XO14 TH Y Y 0% Pb 0% Pb Lead-Free, Date Code "Feb 2006" & later
XO08 TH Y Y 0% Pb 0% Pb Lead-Free, Date Code "Feb 2006" & later
XO14H TH Y Y 0% Pb 0% Pb Lead-Free, Date Code "Feb 2006" & later

TCXOs

Product Series Package Phase 1 Phase 2 Internal Pb % External Pb % Lead Category
TCSS SMD Y Y <0.1% Pb <0.1% Pb Lead-Free, Date Code "Feb 2006" & later
TCSC SMD Y Y <0.1% Pb <0.1% Pb Lead-Free, Date Code "Feb 2006" & later
TCLS SMD Y Y <0.1% Pb 0% Pb Lead-Free, Date Code "Feb 2006" & later
TC75 SMD Y Y 0% Pb 0% Pb Lead-Free
TC75D SMD Y Y 0% Pb 0% Pb Lead-Free
TC53 SMD Y Y 0% Pb 0% Pb Lead-Free
TC32 SMD Y Y 0% Pb 0% Pb Lead-Free
TCTS TH Y Y <0.1% Pb <0.1% Pb Lead-Free, Date Code "Feb 2006" & later
TCTC TH Y Y <0.1% Pb <0.1% Pb Lead-Free, Date Code "Feb 2006" & later
TCHS TH Y Y <0.1% Pb <0.1% Pb Lead-Free
TCHC TH Y Y <0.1% Pb <0.1% Pb Lead-Free
TC2020 TH TBD TBD >0.1% Pb <0.1% Pb

VCXOs

Product Series Package Phase 1 Phase 2 Internal Pb % External Pb % Lead Category
VC75 SMD Y Y 0% Pb 0% Pb Lead-Free
VC75PE SMD Y Y 0% Pb 0% Pb Lead-Free
VCFR SMD Y Y 0% Pb <0.1% Pb Lead-Free, Date Code "Feb 2006" & later
VCFRPE SMD Y Y 0% Pb <0.1% Pb Lead-Free, Date Code "Feb 2006" & later
VC14 TH Y Y 0% Pb 0% Pb Lead-Free, Date Code "Feb 2006" & later
VC08 TH Y Y 0% Pb 0% Pb Lead-Free, Date Code "Feb 2006" & later
VC14H TH Y Y 0% Pb 0% Pb Lead-Free, Date Code "Feb 2006" & later
VC14T TH Y Y 0% Pb 0% Pb Lead-Free, Date Code "Feb 2006" & later
VC14HT TH Y Y 0% Pb 0% Pb Lead-Free, Date Code "Feb 2006" & later

OCXOs

Product Series Package Phase 1 Phase 2 Internal Pb % External Pb % Lead Category
OC14S TH Y Y <0.1% Pb <0.1% Pb Lead-Free, Date Code "Oct 2010" & later
OC14C TH Y Y <0.1% Pb <0.1% Pb Lead-Free, Date Code "Oct 2010" & later
OC20S TH Y Y <0.1% Pb <0.1% Pb Lead-Free, Date Code "Oct 2010" & later
OC20C TH Y Y <0.1% Pb <0.1% Pb Lead-Free, Date Code "Oct 2010" & later
OC25S TH Y Y <0.1% Pb <0.1% Pb Lead-Free, Date Code "Oct 2010" & later
OC25C TH Y Y <0.1% Pb <0.1% Pb Lead-Free, Date Code "Oct 2010" & later
OC36S TH Y Y <0.1% Pb <0.1% Pb Lead-Free, Date Code "Oct 2010" & later
OC36C TH Y Y <0.1% Pb <0.1% Pb Lead-Free, Date Code "Oct 2010" & later

Ceramic Resonators

ZTACV-ZTTCV SMD Y Y 0% Pb 0% Pb Lead-Free
ZTASM SMD Y Y 0% Pb 0% Pb Lead-Free
ZTTSM SMD Y Y 0% Pb 0% Pb Lead-Free
ZTA TH Y Y 0% Pb 0% Pb Lead-Free
ZTT TH Y Y 0% Pb 0% Pb Lead-Free

MCFs

MS1 SMD Y Y 0% Pb 0% Pb Lead-Free
MS2 SMD Y Y 0% Pb 0% Pb Lead-Free
MUHF TH Y Y 0% Pb 0% Pb Lead-Free